Four-target magnetron sputtering coating system with a transfer chamber

This four-target magnetron sputtering coating system is a cost-effective, independently developed product of our company, featuring standardization, modularity, and customizable options. The magnetron targets are available in 1-inch, 2-inch, 3-inch, and 4-inch sizes, allowing customers to select the size that best matches the dimensions of their substrates. The system is equipped with a 500 W DC power supply and a 500 W RF power supply: the DC power supply is suitable for depositing metallic films, while the RF power supply is ideal for non-metallic films. With four targets, the system can accommodate multi-layer or sequential coating processes. For additional coating requirements, custom RF and pulsed power supplies can be configured; all power supply models are available in a range of specifications from 300 W to 1000 W.

Key features: 
1. It comprises a main chamber and a transition chamber; the transition chamber is equipped with a magnetic push rod, and a vacuum gate valve is installed between the two chambers. 
2. While sputtering is underway in the main chamber, samples can be loaded into the transfer chamber and subjected to preliminary vacuum pumping. Once sputtering in the main chamber is complete, the samples can be transferred into the main chamber’s sample holder via a magnetic push rod. This design reduces the number of times the main chamber needs to be evacuated, thereby saving time, maintaining a superior local vacuum, and effectively improving coating quality. 
3. It can be used to prepare single-layer or multi-layer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard coatings, polytetrafluoroethylene films, and more. 
4. Its compact size makes it easy to operate, making it an ideal device for laboratory-scale preparation of thin films. The high-vacuum environment throughout the entire evaporation process ensures that evaporated atoms or molecules reach the substrate directly, thereby preventing contamination by airborne impurities. 
5. High-vacuum conditions help minimize oxidation of the evaporation material, thereby further enhancing the purity and performance of the thin film.