Three-Target Magnetron Sputtering Coating System

Category: Magnetron sputtering system

This product is a laboratory-specific magnetron sputtering coating system independently developed by our company. It boasts broad applicability and can efficiently deposit single- or multilayer thin films of ferroelectric, conductive, alloy, semiconductor, and other materials, thereby meeting the thin-film preparation needs of laboratories across multiple disciplines. Compared with similar equipment, this system offers comprehensive application versatility, a compact footprint, and user-friendly operation, while also supporting flexible adaptation and customized upgrades. With its high cost-effectiveness and practicality, it effectively enhances experimental efficiency and is the preferred choice for laboratory-based thin-film material deposition.

Overview

Technical Specifications

This product is a cost-effective, laboratory-specific magnetron sputtering coating system independently developed by our company. Built on a standardized architecture and modular design with customizable adaptation options, it strikes an optimal balance between performance and ease of use, making it the preferred equipment for thin-film fabrication in laboratories. It is widely compatible with experimental requirements across multiple disciplines and can efficiently deposit single- or multi-layer films of ferroelectric, conductive, alloy, semiconductor, ceramic, dielectric, optical, oxide, hard-material, and polytetrafluoroethylene coatings, thereby facilitating the efficient advancement of research projects.

Product Features:

1. The target power supply is highly flexible and configurable: users can choose a 1/2-inch magnetron sputtering target, with a standard dual-power configuration of 500 W DC (for metal films) and RF (for non-metal films). The three-target design effortlessly meets the demands of multi-layer and multi-pass coating, and custom power supplies ranging from 300 W to 1000 W are also available to suit a wide variety of experimental applications.

2. The gas-path vacuum system is outstanding, featuring two high-precision mass flow meters as standard (with customization available up to four channels), paired with an advanced turbomolecular pump unit that achieves an ultimate vacuum of 1.0 × 10⁻⁵ Pa. It supports sampling without shutting down the pump, significantly reducing experimental time and enhancing work efficiency.

3. Convenient and hassle-free operation, compact footprint for easy placement, optional all-in-one industrial PC, one-button control of the entire system—including the vacuum pump unit and sputtering power supply—streamlining workflows, lowering the barrier to experimentation, and accommodating a wide range of laboratory applications.

Project Details
Supply voltage AC 220V, 50Hz
Total machine power 4KW
System vacuum ≦5×10⁻⁴ Pa
Sample stage External dimensions φ150mm
Heating temperature ≦600℃
Temperature control accuracy ±1℃
Adjustable speed ≦20 rpm
Magnetic Control Target Gun Target material dimensions Diameter Φ50.8 mm, thickness ≤ 3 mm
Cooling mode Recirculating Water Cooling
Water flow rate Not less than 10 L/min
Vacuum chamber Cavity dimensions Diameter φ500mm, height 420mm
Cavity Material SUU304 stainless steel
Observation Window Diameter φ100mm
Activation Method Front-opening
Gas Control The Type 1 mass flow meter is used to control the Ar flow.
Vacuum system One set of molecular pump system, with a gas pumping speed of 600 L/s.
Film thickness measurement Optional quartz crystal film-thickness meter, with a resolution of 0.10 Å.
Sputtering power supply DC power supply: 500 W × 2; RF power supply: 500 W
Control System Self-developed professional-grade control system
Equipment dimensions 600mm × 650mm × 1280mm
Equipment weight 350kg

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