Desktop Compact Three-Target Magnetron Sputtering Coating System
Category: Magnetron sputtering system
Overview
Technical Specifications
This product is a compact, desktop, three-target magnetron sputtering coating system independently developed by our company. It features a space-saving, compact design that is perfectly suited for laboratory settings. With its standardized, modular architecture, it delivers excellent cost-effectiveness and reliable performance, making it the ideal choice for thin-film deposition in research laboratories. Its primary application is the efficient preparation of single- or multi-layer films, including ferroelectric, conductive, alloy, and semiconductor materials, thereby meeting the diverse experimental and R&D needs across multiple fields and helping to accelerate scientific research.
Key features:
1. Compact and space-saving, tailored for laboratory settings: The desktop compact design is small in size and easy to install, allowing flexible integration into various lab environments. It effectively addresses the critical challenge of limited laboratory space and accommodates diverse experimental layouts.
2. Customizable and highly flexible to meet diverse requirements: The magnetron sputtering target is available in a 1/2-inch configuration, precisely matching substrates of different sizes; the standard configuration includes a 500 W DC power supply (suitable for metal thin films), with optional customization to 500–1000 W RF or pulsed power supplies. The gas delivery system is equipped as standard with two high-precision mass flow meters, which can be upgraded to up to four channels, enabling easy establishment of complex gas environments.
3. Highly efficient and hassle-free, with outstanding cost-effectiveness: Standard configuration includes an advanced turbomolecular pump unit, achieving a ultimate vacuum of 1.0 × 10⁻⁵ Pa (other models available as options); solenoid-valve-controlled gas-path design allows sample loading and unloading without shutting down the pump, significantly reducing experimental time; optional integrated industrial-control PC enables full-process automated control, ensuring high efficiency and convenience, while offering a more competitive price-performance ratio compared with similar equipment.
| Project | Details | |
| Supply voltage | AC 220V, 50Hz | |
| Total machine power | 6KW | |
| System vacuum | ≦5×10⁻⁴ Pa | |
| Sample stage | External dimensions | φ150mm |
| Heating temperature | ≦600℃ | |
| Temperature control accuracy | ±1℃ | |
| Adjustable speed | ≦20 rpm | |
| Magnetic Control Target Gun | Target material dimensions | Diameter Φ50.8 mm, thickness ≤ 3 mm |
| Cooling mode | Recirculating Water Cooling | |
| Water flow rate | Not less than 10 L/min | |
| Number of target guns | 3 | |
| Vacuum chamber | Cavity dimensions | Diameter φ300mm, height 500mm |
| Cavity Material | SUU304 stainless steel | |
| Observation Window | Diameter φ100mm | |
| Activation Method | Top-opening | |
| Gas Control | The Model 1 mass flow meter is used to control the Ar flow, with a range of 200 SCCM. | |
| Vacuum system | One set of molecular pump system, with a gas pumping speed of 600 L/s. | |
| Film thickness measurement | Optional quartz crystal film-thickness meter, with a resolution of 0.10 Å. | |
| Sputtering power supply | Equipped with DC power supplies, each rated at 500 W × 3. | |
| Control System | Self-developed professional-grade control system | |
| Equipment dimensions | 540 mm L x 540 mm W x 1000 mm H | |
| Equipment weight | 145kg | |
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