Desktop Compact Three-Target Magnetron Sputtering Coating System

Category: Magnetron sputtering system

This product is a laboratory-specific coating system independently developed by our company. At its core, it features a compact benchtop design that is small in size and easy to install, making it highly adaptable to various laboratory settings and effectively addressing the challenge of limited space—thus making it the preferred equipment for thin-film fabrication in laboratories. The system adopts a standardized, modular design with strong customization flexibility, allowing for tailored magnetron sputtering targets, power supply specifications, and upgrades to the gas delivery system. It comes standard with a turbo-molecular pump unit and offers optional automated control, delivering high efficiency, hassle-free operation, and outstanding cost-effectiveness. It can efficiently deposit a wide range of single-layer and multilayer thin films, making it suitable for experimental and R&D applications across numerous fields.

Overview

Technical Specifications

This product is a compact, desktop, three-target magnetron sputtering coating system independently developed by our company. It features a space-saving, compact design that is perfectly suited for laboratory settings. With its standardized, modular architecture, it delivers excellent cost-effectiveness and reliable performance, making it the ideal choice for thin-film deposition in research laboratories. Its primary application is the efficient preparation of single- or multi-layer films, including ferroelectric, conductive, alloy, and semiconductor materials, thereby meeting the diverse experimental and R&D needs across multiple fields and helping to accelerate scientific research.

Key features:

1. Compact and space-saving, tailored for laboratory settings: The desktop compact design is small in size and easy to install, allowing flexible integration into various lab environments. It effectively addresses the critical challenge of limited laboratory space and accommodates diverse experimental layouts.

2. Customizable and highly flexible to meet diverse requirements: The magnetron sputtering target is available in a 1/2-inch configuration, precisely matching substrates of different sizes; the standard configuration includes a 500 W DC power supply (suitable for metal thin films), with optional customization to 500–1000 W RF or pulsed power supplies. The gas delivery system is equipped as standard with two high-precision mass flow meters, which can be upgraded to up to four channels, enabling easy establishment of complex gas environments.

3. Highly efficient and hassle-free, with outstanding cost-effectiveness: Standard configuration includes an advanced turbomolecular pump unit, achieving a ultimate vacuum of 1.0 × 10⁻⁵ Pa (other models available as options); solenoid-valve-controlled gas-path design allows sample loading and unloading without shutting down the pump, significantly reducing experimental time; optional integrated industrial-control PC enables full-process automated control, ensuring high efficiency and convenience, while offering a more competitive price-performance ratio compared with similar equipment.

Project Details
Supply voltage AC 220V, 50Hz
Total machine power 6KW
System vacuum ≦5×10⁻⁴ Pa
Sample stage External dimensions φ150mm
Heating temperature ≦600℃
Temperature control accuracy ±1℃
Adjustable speed ≦20 rpm
Magnetic Control Target Gun Target material dimensions Diameter Φ50.8 mm, thickness ≤ 3 mm
Cooling mode Recirculating Water Cooling
Water flow rate Not less than 10 L/min
Number of target guns 3
Vacuum chamber Cavity dimensions Diameter φ300mm, height 500mm
Cavity Material SUU304 stainless steel
Observation Window Diameter φ100mm
Activation Method Top-opening
Gas Control The Model 1 mass flow meter is used to control the Ar flow, with a range of 200 SCCM.
Vacuum system One set of molecular pump system, with a gas pumping speed of 600 L/s.
Film thickness measurement Optional quartz crystal film-thickness meter, with a resolution of 0.10 Å.
Sputtering power supply Equipped with DC power supplies, each rated at 500 W × 3.
Control System Self-developed professional-grade control system
Equipment dimensions 540 mm L x 540 mm W x 1000 mm H
Equipment weight 145kg

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