Single-Target Magnetron Sputtering Fiber-Winding Coating System
Category: Magnetron sputtering system
Overview
Technical Specifications
This product is a specialized thin-film deposition system based on physical vapor deposition (PVD) technology. It employs single-target magnetron sputtering combined with fiber-winding wire technology to sputter high-purity target particles under the combined action of high voltage and magnetic fields, which are then deposited onto a substrate to form a thin film. The system is suitable for a wide range of research and industrial applications. Its primary application is the fabrication of high-quality thin films, which are extensively used in microelectronics, optics, and new energy sectors. Specifically, it can produce high-reflectivity/anti-reflective optical coatings, conductive films for semiconductors, solar cells, and LED devices, as well as protective coatings with water-repellent and wear-resistant properties.
Key features:
1. Equipped with a 2-inch single-target magnetron sputtering target and a water-cooling system; the vacuum chamber is made of 304 stainless steel (Φ213 mm × 307 mm) and features a composite vacuum gauge to ensure a clean deposition environment; the wire-winding speed is adjustable from 1 to 300 r/min; the total power rating is 2 kW, with an AC 220 V, 50 Hz power supply that automatically matches the load, ensuring convenient operation, stable performance, and high coating accuracy and efficiency.
2. Superior film quality: The prepared thin films are uniform and dense, exhibit high purity and strong adhesion, meet the requirements of high-precision applications, and are compatible with a wide range of substrate materials.
3. Precise and Efficient Control: By integrating fiber-winding technology, the target-to-substrate distance and sputtering energy can be flexibly adjusted, enabling precise control over film thickness and composition while enhancing sputtering rate and film quality.
4. Wide range of applications: Compatible with a variety of target materials, including metals and alloys, it can meet the thin-film deposition requirements across multiple fields such as optics, electronics, and protective coatings, while catering to both research and industrial applications.
| Supply voltage | AC 220V, 50Hz | |
| Total machine power | 2kw | |
| Wire-wrapping mechanism | Size | Φ15mm x 245mm |
| Wire winding speed | 1-300r/min | |
| Magnetron sputtering target | Quantity | 2 inches x 1 |
| Cooling method | Water cooling | |
| Vacuum chamber | Cavity dimensions | Φ213mm x 307mm |
| Observation Window | φ80mm | |
| Activation method | Top-opening and left-side-opening | |
| Cavity material | Stainless steel 304 | |
| Power Configuration | Number of DC power supplies | 1 unit |
| Output power | ≤300W | |
| Matching Method | Automatic matching | |
| Water-cooling system | Water tank capacity | 9L |
| Traffic | 10L/min | |
| Gas Supply System | Type | Manual Micro-Adjustment Valve |
| Vacuum system | Front-stage pump | Two-stage rotary vane pump |
| Pumping speed | 1.1L/s | |
| Secondary pump | Turbomolecular pump | |
| Pumping speed | 60L/s | |
| Exhaust port | ISO63 | |
| Air outlet | KF16 | |
| Vacuum gauge | Composite vacuum gauge | |
| Equipment weight | 350kg | |
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