Three-Target Magnetron Sputtering Coating System with a Transition Chamber

Category: Magnetron sputtering system

This product is a specialized, high-precision metal thin-film deposition system with outstanding core advantages and a wide range of application scenarios. The equipment is equipped with three magnetron sputtering targets and two DC power supplies, enabling flexible deposition of multilayer conductive metal films. Its design features a separate main chamber and transfer chamber, coupled with magnetic push rods and vacuum gate valves, which allow for simultaneous sample loading and vacuum pumping during sputtering—saving time while maintaining the required vacuum level in the main chamber and enhancing coating quality. The system is widely used in electronics, optics, and the production of advanced ceramics, and is also well-suited for preparing SEM samples in laboratories, thereby meeting both research and industrial needs. It offers stable performance and convenient operation.

Overview

Technical Specifications

This product is a three-target magnetron sputtering coating system with a transition chamber, a precision instrument specifically designed for the preparation of metallic thin films. It meets both research and practical application needs, with a structural design tailored to laboratory settings and related industrial applications, ensuring stable and reliable performance. Its primary function is the efficient deposition of metallic thin films, making it widely used in industries such as electronics, optics, and the production of advanced ceramics. Additionally, it is compatible with SEM sample preparation in laboratories, satisfying diverse application requirements for scientific research, experimental studies, and new-materials development.

Key features:

1. Multi-target synergy for multi-layer coating: Equipped with three magnetron sputtering targets and two DC power supplies, this system enables flexible deposition of multi-layer conductive metal films, accommodating diverse film-layer requirements and enhancing operational flexibility.

2. Dual-chamber design for high efficiency and energy savings: The system features a separate main chamber and a transfer chamber, with the transfer chamber equipped with a magnetic push rod and a vacuum gate valve between the two chambers. This configuration allows for sputtering to proceed concurrently with sample loading and pre-vacuum pumping, thereby reducing the number of vacuum pumping cycles in the main chamber and significantly saving time.

3. Controllable vacuum for enhanced coating quality: The dual-chamber independent vacuum design effectively maintains the local vacuum level in the main chamber, minimizes impurity interference, and significantly improves film density and uniformity, thereby delivering high-quality coating results.

Sample stage External dimensions Φ360mm
Adjustable speed Adjustable from 1 to 20 rpm
Magnetic Control Target Gun Target plane Circular planar target
Sputtering vacuum 0.1 Pa to 3 Pa
Target diameter 100–101.6 mm
Target thickness 3mm
Insulation voltage >2000V
Cable Specifications SL-16
Target head temperature ≦65℃
Vacuum chamber Inner wall treatment Electropolishing
Cavity dimensions Φ500mm × 500mm
Cavity material 304 stainless steel
Observation Window Quartz window, diameter φ100mm
Activation Method Side opening
Gas Control Traffic Control Mass flow meter, range 0–100 SCCM
Types of gases Optional gases include argon, nitrogen, oxygen, and more.
Control Valve Type Electromagnetic control valve
Static state of the control valve Normally Closed
Measure linearity ±1.5% F.S
Measurement repeatability ±0.2% F.S
Measure response time ≤8 seconds (T95)
Operating pressure differential range 0.3MPa
Valve body pressure rating 3MPa
Operating ambient temperature (5–45)°C
Valve body material Stainless steel 316L
Valve body leak rate 1×10⁻⁸ Pa·m³/s
Pipe fitting 1/4″ ferrule fitting
Input/Output Signals 0–5 V
Power supply ±15 V (±5%) (+15 V, 50 mA; −15 V, 200 mA)
External dimensions mm 130 (width) × 102 (height) × 28 (thickness)
Communication interface RS485 MODBUS Protocol
DC power supply Power supply wattage 1500W
Film thickness measurement Power Requirements DC: 5V (±10%) * High current 400mA
Resolution ±0.03 Hz (5–6 MHz), 0.0136 Å / measurement (aluminum)
Measurement accuracy ±0.5% thickness + 1 count
Measurement cycle 100 ms to 1 s per measurement (adjustable)
Measurement range 500,000 Å (aluminum)
Crystal frequency 6MHz
Communication interface RS-232/485 serial interface
Display Digits 8-digit LED display
Molecular pump Molecular pump pumping speed 1200L/S
Rated speed 24000rpm
Vibration value ≦0.1 µm
Startup Time 5min
Downtime 7min
Cooling method Water cooling + air cooling
Cooling water temperature ≦37℃
Coolant flow rate 1L/min
Installation Direction Vertical ±5°
Vacuum port 150CF
Exhaust port KF40
Front-stage pump Pumping speed VRD-16
Ultimate vacuum 1Pa
Power supply AC: 220V/50Hz
Motor power 400W
Noise ≦56 dB
Vacuum port KF40
Exhaust port KF25
Valve Gate valve A gate valve is installed between the vacuum chamber and the molecular pump.
Shut-off valve A shut-off valve is installed between the molecular pump and the backing pump.
Bypass valve A bypass valve is installed between the vacuum chamber and the forepump.
Bleed valve An electromagnetic vent valve is installed on the vacuum chamber.
Ultimate vacuum of the entire machine ≦5×10⁻⁴ Pa
Test target material One nickel target with a diameter of 4 inches and a thickness of 3 mm

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