Electron-beam evaporation coating system

Category: Electron-beam evaporation

This product is an electron-beam evaporation coating system primarily used for the preparation of various conductive films, semiconductor films, ferroelectric films, and optical films. It finds applications in micro- and nano-device fabrication, as well as in the pre-treatment of electron microscopy samples, and is particularly well suited for the evaporation deposition of a wide range of refractory metal materials. In addition to hard substrates such as glass and silicon wafers, it can also be used for coating flexible substrates like PDMS, PTFE, and PI.

Overview

Technical Specifications

This product, in an ultra-high vacuum environment:

The electron gun filament (tungsten/LaB₆) emits thermoelectrons upon heating.
The electrons are accelerated by a high voltage of 10–30 kV and then focused by electromagnetic lenses followed by a 270° magnetic deflection, resulting in a high-energy, highly precise electron beam.
An electron beam is directed at the target material housed in a water-cooled copper crucible, generating localized, instantaneous temperatures of 3,000–6,000°C, which cause the target to melt or sublimate into gaseous atoms or molecules.
Gaseous particles travel in straight lines through a vacuum and deposit onto the surface of a rotating or heated substrate, where they condense to form a uniform, dense thin film.
Throughout the entire process, a quartz crystal oscillator provides real-time monitoring of film thickness and deposition rate (0.1–10 nm/s), enabling closed-loop control.

Terms of Use Ambient temperature: 5°C to 40°C; Power supply: three-phase 380 V; Power rating: ≤20 kW; Water pressure: ≤2.5 bar.
Vacuum chamber dimensions Evaporation chamber dimensions: φ500 × H500 (mm)
Electron gun One set of new-type electron gun, six-hole crucible
Sample Turntable Sample dimensions: ≤φ150 mm; the sample can be rotated and vertically adjusted to regulate the distance between the sample and the electron gun (the sample holder design is customized according to user requirements); heating temperature: ≤500°C.
System vacuum level Ultimate vacuum After 12–24 hours of baking, the continuous pumping rate shall be ≤5×10⁻⁵ Pa.
Pumping speed Within 40 minutes from the start of evacuation, the vacuum level shall be ≤5×10⁻⁴ Pa.
System leak rate The overall leak rate of the system shall be ≤1×10⁻⁸ Pa·L/s. After the pump is stopped and the system is shut down for 12 hours, the vacuum level in the vacuum chamber shall be ≤10 Pa.
Vacuum System FB1200 molecular pump combined with a mechanical pump (TRP-36) system, with a bypass pumping configuration.
Coating Monitoring Monitoring is conducted using the SQM160 film thickness gauge.
Coating thickness Coating thickness non-uniformity ≤ 6%

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