Plasma cleaner

Category: Sample Cleaning

This plasma cleaner is a compact, non-destructive cleaning device. It employs low-pressure plasma generation as the cleaning medium, effectively eliminating secondary contamination that can result from liquid cleaning agents.

Overview

Technical Specifications

This product is a high-performance device specifically developed to meet the material surface modification needs of laboratory and industrial settings. With “clean efficiency, multifunctionality, and broad applicability” as its core positioning, it balances precision processing with user-friendly operation, making it an ideal solution for the diverse experimental and production environments found in university and research institute laboratories as well as corporate R&D facilities. It provides stable and reliable hardware support for the surface treatment, cleaning, and modification of a wide range of materials.

Key features:

  1. Leading clean-processing capabilities: Utilizing high-precision plasma activation technology, this process efficiently removes organic contaminants, oil residues, dust, and oxides from material surfaces, achieving atomic-level cleanliness, ensuring surface purity, and enhancing adhesion in subsequent processing steps.
  2. Versatile functionality and adaptability: Supports multiple modes, including plasma cleaning, etching, surface activation, and hydrophilization, enabling customized processing for a wide range of substrates such as silicon wafers, crystals, metals, polymers, and ceramics, thereby meeting diverse experimental requirements.
  3. Precision and high-efficiency operation: Equipped with a high-precision vacuum control system and an RF power supply, the plasma exhibits uniform density and stable energy, ensuring consistent processing results. Process time and parameters can be precisely controlled, minimizing human error.
  4. Convenient and Easy-to-Use Control: Touchscreen operation combined with preset process parameters streamlines the workflow, enabling even beginners to get up to speed quickly. The compact, space-saving design is both robust and aesthetically pleasing, minimizing footprint while ensuring easy maintenance and compatibility with a wide range of laboratory countertops.
Supply voltage AC 220V, 50Hz
Total machine power 6KW
System vacuum ≦5×10⁻⁴ Pa
Sample stage External dimensions φ150mm
Heating temperature ≦600℃
Temperature control accuracy ±1℃
Adjustable speed ≦20 rpm
Magnetic Control Target Gun Target material dimensions Diameter Φ50.8 mm, thickness ≤ 3 mm
Cooling mode Recirculating Water Cooling
Water flow rate Not less than 10 L/min
Quantity 2
Vacuum chamber Cavity dimensions Diameter φ325mm, height 500mm
Cavity Material SUU304 stainless steel
Observation Window Diameter φ100mm
Activation Method Top-opening
Gas Control The Model 1 mass flow meter is used to control the Ar flow, with a range of 200 SCCM.
Vacuum system One set of molecular pump system, with a gas pumping speed of 600 L/s.
Film thickness measurement Optional quartz crystal film-thickness meter, with a resolution of 0.10 Å.
Sputtering power supply Equipped with a DC power supply, 500 W power, and 500 W RF.
Control System Self-developed professional-grade control system
Equipment dimensions 540mm×540mm×1000mm
Equipment weight 350kg

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