Plasma cleaner
Category: Sample Cleaning
Overview
Technical Specifications
This product is a high-performance device specifically developed to meet the material surface modification needs of laboratory and industrial settings. With “clean efficiency, multifunctionality, and broad applicability” as its core positioning, it balances precision processing with user-friendly operation, making it an ideal solution for the diverse experimental and production environments found in university and research institute laboratories as well as corporate R&D facilities. It provides stable and reliable hardware support for the surface treatment, cleaning, and modification of a wide range of materials.
Key features:
- Leading clean-processing capabilities: Utilizing high-precision plasma activation technology, this process efficiently removes organic contaminants, oil residues, dust, and oxides from material surfaces, achieving atomic-level cleanliness, ensuring surface purity, and enhancing adhesion in subsequent processing steps.
- Versatile functionality and adaptability: Supports multiple modes, including plasma cleaning, etching, surface activation, and hydrophilization, enabling customized processing for a wide range of substrates such as silicon wafers, crystals, metals, polymers, and ceramics, thereby meeting diverse experimental requirements.
- Precision and high-efficiency operation: Equipped with a high-precision vacuum control system and an RF power supply, the plasma exhibits uniform density and stable energy, ensuring consistent processing results. Process time and parameters can be precisely controlled, minimizing human error.
- Convenient and Easy-to-Use Control: Touchscreen operation combined with preset process parameters streamlines the workflow, enabling even beginners to get up to speed quickly. The compact, space-saving design is both robust and aesthetically pleasing, minimizing footprint while ensuring easy maintenance and compatibility with a wide range of laboratory countertops.
| Supply voltage | AC 220V, 50Hz | |
| Total machine power | 6KW | |
| System vacuum | ≦5×10⁻⁴ Pa | |
| Sample stage | External dimensions | φ150mm |
| Heating temperature | ≦600℃ | |
| Temperature control accuracy | ±1℃ | |
| Adjustable speed | ≦20 rpm | |
| Magnetic Control Target Gun | Target material dimensions | Diameter Φ50.8 mm, thickness ≤ 3 mm |
| Cooling mode | Recirculating Water Cooling | |
| Water flow rate | Not less than 10 L/min | |
| Quantity | 2 | |
| Vacuum chamber | Cavity dimensions | Diameter φ325mm, height 500mm |
| Cavity Material | SUU304 stainless steel | |
| Observation Window | Diameter φ100mm | |
| Activation Method | Top-opening | |
| Gas Control | The Model 1 mass flow meter is used to control the Ar flow, with a range of 200 SCCM. | |
| Vacuum system | One set of molecular pump system, with a gas pumping speed of 600 L/s. | |
| Film thickness measurement | Optional quartz crystal film-thickness meter, with a resolution of 0.10 Å. | |
| Sputtering power supply | Equipped with a DC power supply, 500 W power, and 500 W RF. | |
| Control System | Self-developed professional-grade control system | |
| Equipment dimensions | 540mm×540mm×1000mm | |
| Equipment weight | 350kg | |
You May Also Like
Price Inquiry
You can contact us through any convenient means, and we provide services 24/7 via phone or email. We are happy to answer your questions