Three-Target Vertical Magnetron Sputtering Coating System
Category: Thin Film Preparation
Overview
Technical Specifications
This product is a high-performance system specifically developed to meet the needs of multi-component, multilayer thin-film deposition in laboratory settings. Its core design principles are “multi-target compatibility, precise film formation, vertical compact footprint, and user-friendly operation,” balancing research-grade precision with compact, practical design. It is ideally suited for a wide range of coating experiments in university, research institute, and corporate laboratories, providing stable and reliable hardware support for the preparation of various metallic, oxide, and semiconductor thin films.
Key features:
- Leading multi-target design: Equipped with a three-independent-target system that supports single-target continuous sputtering, dual-target co-sputtering, and three-target alternating deposition, enabling flexible preparation of multilayer films, alloy films, and composite films, thereby significantly expanding the diversity of experimental processes.
- Precision and High-Efficiency Film Deposition: Equipped with a high-precision, high-vacuum control system and stable DC/RF sputtering power supplies, the sputtering process is stable and free of fluctuations, resulting in uniform, dense films with strong adhesion and precise assurance of film thickness and performance consistency.
- Convenient and easy-to-control operation: touchscreen interface combined with pre-set coating process curves simplifies the workflow, lowers the learning curve, enables quick onboarding for beginners, and minimizes human error.
- Laboratory Adaptation and Optimization: Vertical chamber design for a compact footprint that saves bench space, with convenient chamber opening and closing for efficient sample loading and unloading; modular construction ensures robust durability and easy maintenance, while accommodating various laboratory bench configurations.
- Widely applicable : It can be used to fabricate various functional thin films, including metals, alloys, oxides, and nitrides, which are widely employed in semiconductor devices, optical coatings, sensors, new energy materials, surface modification, and other fields.
| Project | Details | |
| Supply voltage | AC 220V, 50Hz | |
| Total machine power | 4KW | |
| System vacuum | ≦5×10⁻⁴ Pa | |
| Sample stage | External dimensions | φ150mm |
| Heating temperature | ≦600℃ | |
| Temperature control accuracy | ±1℃ | |
| Adjustable speed | ≦20 rpm | |
| Magnetic Control Target Gun | Target material dimensions | Diameter Φ50.8 mm, thickness ≤ 3 mm |
| Cooling mode | Recirculating Water Cooling | |
| Water flow rate | Not less than 10 L/min | |
| Vacuum chamber | Cavity dimensions | Diameter φ500 mm, height 420 mm |
| Cavity Material | SUU304 stainless steel | |
| Observation Window | Diameter φ100mm | |
| Activation Method | Front-opening | |
| Gas Control | The Type 1 mass flow meter is used to control the Ar flow. | |
| Vacuum system | One set of molecular pump system, with a gas pumping speed of 600 L/s. | |
| Film thickness measurement | Optional quartz crystal film-thickness meter, with a resolution of 0.10 Å. | |
| Sputtering power supply | DC power supply: 500 W × 2; RF power supply: 500 W | |
| Control System | CYKY’s self-developed professional-grade control system | |
| Equipment dimensions | 600mm × 650mm × 1280mm | |
| Equipment weight | 350kg | |
| Equipment weight | 350kg | |
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