Dual-Target Plasma Sputtering Coater
Category: Thin Film Preparation
Overview
Technical Specifications
This high-performance equipment is specifically designed to meet the multi-component thin-film deposition needs of laboratories, with a core positioning centered on “multi-target compatibility, precise film formation, and stable, easy-to-control operation.” It strikes an optimal balance between research-grade precision and practical usability, seamlessly adapting to the diverse coating experimentation scenarios found in university, research institute, and corporate laboratories, and providing stable, reliable hardware support for the preparation of various metallic, alloy, and compound thin films.
Key features:
- Industry-leading dual-target design: Equipped with a dual-independent-target plasma sputtering system, it supports single-target continuous sputtering, dual-target co-sputtering, or alternating deposition, enabling flexible fabrication of multilayer films, alloy films, and composite functional films, thereby significantly expanding the diversity of experimental processes.
- Precise and efficient film deposition: Equipped with a stable plasma power supply and a high-precision vacuum control system, the plasma is uniformly excited and the sputtering process is smooth and stable, resulting in dense, uniform films with strong adhesion. This ensures precise control over film thickness and consistent performance.
- Convenient and easy-to-control operation: touchscreen interface combined with multiple pre-set coating process curves simplifies the workflow, lowers the learning curve, enables quick onboarding for beginners, and minimizes human error.
- Laboratory Adaptation and Optimization: Modular, compact structural design ensures a moderate footprint, robust durability, efficient space utilization, and easy maintenance, making it suitable for placement on various laboratory workstations and for use in research and teaching settings.
- Wide range of applications: It can be used to fabricate various functional thin films, including metals, alloys, oxides, nitrides, and more, with extensive applications in semiconductor devices, optical coatings, sensors, new energy materials, surface modification, and other fields.
| Project | Details | |
| Sample Platform | Size | 100mm |
| Distance to the target surface | Height adjustable from 20 to 35 mm | |
| Rotational speed | Adjustable from 1 to 20 rpm | |
| Plasma sputtering target | Quantity | 2 inches x 2 |
| Cooling method | Natural cooling | |
| Vacuum chamber | Cavity dimensions | φ180mm × 200mm |
| Observation Window | Omnidirectional Visibility | |
| Cavity material | High-purity quartz | |
| Activation method | Top-cover detachable | |
| Material of the top and bottom covers | 304 stainless steel | |
| Vacuum port | KF25 | |
| Intake port | 1/4-inch ferrule fitting | |
| Power Configuration | Quantity | DC power supply x1 |
| Output power | *Large 150W | |
| Sputtering power supply | 3000V | |
| *Large sputtering current | 50mA | |
| Vacuum system | Vacuum Pump Type | Two-stage rotary vane vacuum pump |
| Vacuum port | KF25 | |
| Exhaust port | KF16 | |
| Pumping speed | 1.1 L/s (4 m³/h) | |
| Ultimate vacuum degree | ≥1Pa | |
| Vacuum measurement | Resistance vacuum gauge | |
| Other | Power supply | AC 220V 50Hz |
| Total machine power | 1.5kW | |
| Overall dimensions | 570mm x 450mm x 500mm | |
| Overall weight | 30kg | |
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