Chassis-heated, corrosion-resistant coating machine

This product primarily employs the centrifugal coating principle to deposit liquid or colloidal materials onto substrates such as silicon wafers, crystals, quartz, and ceramics, thereby forming thin films; this process is widely used in materials research. The top cover is made of PVC, offering high light transmittance and allowing observation of the spin-coating process. A drain port is provided at the bottom of the chamber, through which waste liquid can be collected into an external collection bottle for convenient disposal. The base plate features integrated, precise heating: the substrate stage (base plate) is equipped with a built-in heating module (heating film or heating rod), paired with a platinum resistance thermometer and PID temperature control, enabling a temperature range typically from room temperature to 200°C with a control accuracy of ±1°C. This allows for rapid adjustment of the photoresist viscosity, promotes leveling and pre-curing, and enhances film thickness uniformity.

Key features:
1. Fully Enclosed, Highly Corrosion-Resistant Materials: Components in contact with photoresist, such as the chamber body, base plate, and dispensing nozzle, are made of polytetrafluoroethylene (PTFE), polypropylene (PP), or Teflon coating, providing exceptional resistance to strong acids, strong bases, and organic solvents. These materials are compatible with photoresists, PI liquids, corrosive precursors, and other process chemicals.
2. Precision Spin Coating with Multi-Stage Programming: Equipped with a brushless servo motor, the system offers a speed range of 0–12,000 rpm and an adjustable acceleration of 100–8,000 rpm/s. It supports multi-stage speed and time programming, is compatible with adhesives ranging from low to high viscosity, and delivers film thickness accuracy within ±1%–3%.
3. Corrosion-Resistant Sealing and Waste Liquid Management: A double O-ring seal is employed to prevent the leakage of corrosive gases; the chamber features a curved bottom and a drain pipe, which, in conjunction with a splash-proof waste collection container, enable the safe collection and discharge of corrosive waste liquids, thereby preventing contamination and equipment corrosion.
4. Intelligent Control and Safety Protection: Equipped with a touch-screen HMI that allows pre-setting of spin-coating and heating profiles, with real-time display of rotation speed and temperature; features under-adsorption detection for substrates, motor-driven adhesive delivery, over-temperature alarms, and interlock protection, making it suitable for laboratory and small-batch production environments in semiconductor, optical, and new-energy industries.
5. Integrated Precision Heating of the Chassis: The substrate stage (chassis) is equipped with a built-in heating module (heating film or heating rod), paired with a platinum resistance thermometer and PID temperature control, achieving a temperature range typically from room temperature to 200°C with a control accuracy of ±1°C. This enables rapid adjustment of the adhesive viscosity, promotes leveling and pre-curing, and enhances film thickness uniformity.