Electron Beam Evaporation Coater
Category: Materials Research (Research Equipment)
Overview
Technical Specifications
This electron-beam evaporation coating system is a precision deposition instrument that operates in a high-vacuum environment. It uses a high-energy electron beam to bombard and heat the coating material, causing it to melt and vaporize before depositing as a thin film on the substrate surface. The system employs an electron gun to generate and focus an electron beam onto the target material, achieving localized high-temperature evaporation. Coupled with a robust vacuum system, it effectively prevents oxidation and contamination of the materials, making it a core piece of equipment for the fabrication of semiconductor, optical, and micro–nano devices.
This equipment is primarily used for the preparation of high-quality single- or multilayer thin films, capable of vapor-depositing a wide range of materials, including metals, oxides, and dielectrics. It finds extensive applications in the fabrication of semiconductor electrodes, conductive layers, insulating layers, anti-reflection optical coatings, protective films, as well as functional films for sensors, solar cells, and display devices, thereby meeting the demands of high-precision micro- and nano-fabrication.
Its characteristics and advantages:
1. The film layer exhibits high purity, with few impurities and no oxide inclusions under vacuum conditions;
2. The film is dense and uniform, exhibits strong adhesion, has a low defect rate, and demonstrates stable electrical and optical properties;
3. Precise film-thickness control enables nanometer-level thickness regulation with excellent repeatability;
4. It has a wide range of applicable materials and is equally suitable for high-melting-point materials;
5. It causes minimal thermal damage to the substrate, features a clean and environmentally friendly process, and is well suited for sensitive components and high-end precision coating.
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Terms of Use |
Ambient temperature: 5°C to 40°C; Power supply: three-phase 380 V; Power rating: ≤20 kW; Water pressure: ≤2.5 bar. |
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Vacuum chamber dimensions |
Evaporation chamber dimensions: φ500 × H500 (mm) |
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Electron gun |
One set of new-type electron gun, six-hole crucible |
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Sample Turntable |
Sample dimensions: ≤φ150 mm; the sample can be rotated and vertically adjusted to regulate the distance between the sample and the electron gun (the sample holder design is customized according to user requirements); heating temperature: ≤500°C. |
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System vacuum level |
Ultimate vacuum |
After 12–24 hours of baking, the continuous pumping rate shall be ≤5×10⁻⁵ Pa. |
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Pumping speed |
Within 40 minutes from the start of evacuation, the vacuum level shall be ≤5×10⁻⁴ Pa. |
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System leak rate |
The overall leak rate of the system shall be ≤1×10⁻⁸ Pa·L/s. After the pump is stopped and the system is shut down for 12 hours, the vacuum level in the vacuum chamber shall be ≤10 Pa. |
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Vacuum System |
FB1200 molecular pump combined with a mechanical pump (TRP-36) system, with a bypass pumping configuration. |
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Coating Monitoring |
Monitoring is conducted using the SQM160 film thickness gauge. |
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Coating thickness |
Coating thickness non-uniformity ≤ 6% |
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