Electron Beam Evaporation Coater

Category: Materials Research (Research Equipment)

This product is an electron-beam evaporation coating system primarily used for the preparation of various conductive films, semiconductor films, ferroelectric films, and optical films. It finds applications in micro- and nano-device micromachining, electron microscopy sample preparation, and other fields, with particular suitability for the evaporation deposition of a wide range of refractory metal materials. The system is compatible not only with rigid substrates such as glass and silicon wafers but also with flexible substrates like PDMS, PTFE, and PI.

Overview

Technical Specifications

This electron-beam evaporation coating system is a precision deposition instrument that operates in a high-vacuum environment. It uses a high-energy electron beam to bombard and heat the coating material, causing it to melt and vaporize before depositing as a thin film on the substrate surface. The system employs an electron gun to generate and focus an electron beam onto the target material, achieving localized high-temperature evaporation. Coupled with a robust vacuum system, it effectively prevents oxidation and contamination of the materials, making it a core piece of equipment for the fabrication of semiconductor, optical, and micro–nano devices.
This equipment is primarily used for the preparation of high-quality single- or multilayer thin films, capable of vapor-depositing a wide range of materials, including metals, oxides, and dielectrics. It finds extensive applications in the fabrication of semiconductor electrodes, conductive layers, insulating layers, anti-reflection optical coatings, protective films, as well as functional films for sensors, solar cells, and display devices, thereby meeting the demands of high-precision micro- and nano-fabrication.

Its characteristics and advantages:
1. The film layer exhibits high purity, with few impurities and no oxide inclusions under vacuum conditions;
2. The film is dense and uniform, exhibits strong adhesion, has a low defect rate, and demonstrates stable electrical and optical properties;
3. Precise film-thickness control enables nanometer-level thickness regulation with excellent repeatability;
4. It has a wide range of applicable materials and is equally suitable for high-melting-point materials;
5. It causes minimal thermal damage to the substrate, features a clean and environmentally friendly process, and is well suited for sensitive components and high-end precision coating.

Terms of Use

Ambient temperature: 5°C to 40°C; Power supply: three-phase 380 V; Power rating: ≤20 kW; Water pressure: ≤2.5 bar.

Vacuum chamber dimensions

Evaporation chamber dimensions: φ500 × H500 (mm)

Electron gun

One set of new-type electron gun, six-hole crucible

Sample Turntable

Sample dimensions: ≤φ150 mm; the sample can be rotated and vertically adjusted to regulate the distance between the sample and the electron gun (the sample holder design is customized according to user requirements); heating temperature: ≤500°C.

System vacuum level

Ultimate vacuum

After 12–24 hours of baking, the continuous pumping rate shall be ≤5×10⁻⁵ Pa.

Pumping speed

Within 40 minutes from the start of evacuation, the vacuum level shall be ≤5×10⁻⁴ Pa.

System leak rate

The overall leak rate of the system shall be ≤1×10⁻⁸ Pa·L/s. After the pump is stopped and the system is shut down for 12 hours, the vacuum level in the vacuum chamber shall be ≤10 Pa.

Vacuum System

FB1200 molecular pump combined with a mechanical pump (TRP-36) system, with a bypass pumping configuration.

Coating Monitoring

Monitoring is conducted using the SQM160 film thickness gauge.

Coating thickness

Coating thickness non-uniformity ≤ 6%

 

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