Desktop Dual-Target Magnetron Sputtering Coating System

This product is a high-performance system specifically developed to meet the multi-element thin-film deposition needs of laboratories. With “uniform film formation, broad target compatibility, and stable, easy-to-control operation” as its core design principles, it strikes an optimal balance between research-grade precision and practical usability. It is perfectly suited to the diverse experimental settings found in university, research institute, and corporate laboratories, providing stable and reliable hardware support for the preparation of various metallic, oxide, and semiconductor thin films.

Key features:

1. Leading dual-target design: Equipped with a dual-independent target system, it enables single-target continuous sputtering, simultaneous or alternating dual-target sputtering, and supports the deposition of multi-component, multilayer thin films, significantly expanding the diversity of experimental processes.
2. Precision and High-Efficiency Film Deposition: Equipped with a high-precision vacuum control system and stable DC/RF power supplies, the sputtering process is stable and well-controlled, resulting in high target utilization, excellent film uniformity and density, and the ability to meet the requirements of various precision coating experiments.
3. Convenient and easy-to-control operation: touchscreen interface combined with preset process curves simplifies the coating process, lowers the learning curve, enables quick onboarding for beginners, and reduces human error.
4. Highly adaptable for laboratory use: featuring a compact, modular design that is sturdy, aesthetically pleasing, and space-efficient, with easy maintenance; it can be conveniently mounted on various laboratory worktops or integrated into chamber installations.
5. Widely applicable : It can be used to fabricate various thin films, including metals, alloys, oxides, and nitrides, which are widely employed in semiconductor devices, optical coatings, sensors, new energy materials, surface modification, and other fields.