Fully automatic diamond wire cutting machine
Category： Materials Research (Research Equipment)
Overview
Technical Specifications
This product is primarily designed for processing large-sized, high-value materials, with a maximum cutting size of 8 inches. It is especially well suited for cutting large specimens and can also be used to cut seed crystals of synthetic crystalline materials such as silicon, white sapphire, and blue sapphire, as well as for squaring silicon and sapphire crystals. When used for slicing precious gemstones and plastinated biological specimens, it not only produces extremely narrow kerfs but also yields high-quality slices, significantly improving material utilization. This is a continuous-feed diamond-wire cutting machine; once the cutting program is set, the sample is fed continuously without the need for manual adjustment, resulting in highly precise cut dimensions within ±10 μm.
This product employs a reciprocating, single-wire cutting mechanism, allowing for the use of long wire lengths (up to 150 m) and ensuring extended service life per wire spool, thereby significantly enhancing cutting efficiency. The tensioning roller utilizes pneumatic tensioning, with adjustable air pressure that can be fine-tuned according to wire diameter; when using very thin wires, this feature effectively prevents breakage caused by excessive tension. This machine is particularly well-suited for cutting large specimens—especially those exceeding 8 inches in size—and is the ideal choice for sectioning such large samples.
| Project | Details | |
| Technical Specifications | Power supply | 220V 50Hz |
| Power | <1.5 kW (max) | |
| Spindle motor | Servo motor, 750 W power | |
| Y and Z axis motors | Precision Stepper Motor | |
| Wire feed speed for cutting | Adjustable from 0 to 8 m/s, digital display | |
| Total length of the cutting line | ≤150m | |
| Cutting line diameter | ≤0.35mm | |
| Y-axis travel | ≤200mm, digital display | |
| Z-axis travel | ≤200mm, digital display | |
| Indicated feed accuracy of the Y and Z axes | 0.01mm | |
| Workbench corner | 0–360° | |
| Cut sample dimensions | Ø200mm × 200mm (max) | |
| Tensioning System | Pneumatic tensioning; tension air pressure adjustment range: 0–0.7 MPa. | |
| **Control Device | Auto-stop and emergency stop switches | |
| Tensioner | 2 items | |
| Standard Accessories | Guide wheel | 2 items |
| Diamond wire | 2 volumes | |
| Water pump | 1 item | |
| Resin ceramic block | 2 yuan | |
| Paraffin stick | 4 roots | |
| Diamond wire | (Ø0.125mm, Ø0.25mm, Ø0.35mm, Ø0.42mm) | |
| Optional Accessories | Cutting-specific oil | |
| In-house developed wire-cutting machine oscillating mechanism (particularly suitable for cutting high-hardness materials such as gemstones and jade, as well as low-hardness materials like graphite and KDP). | ||
| In-house developed axis-swinging and rotating mechanism (particularly suitable for cutting high-hardness materials, such as jade, etc.). | ||
| Heating platform | ||
| Silent Oil-Free Air Compressor | ||
| DX-100 Single-Crystal Orientation Instrument | ||
| Product Dimensions | 600mm×700mm×1500mm | |
| Weight | Approximately 300 kg | |
| Key Features | 1. Cutting size can reach 8 inches (max). | |
| 2. The main motor drives the diamond cutting wire to move downward at a constant speed, while the workpiece is securely clamped on the worktable and remains stationary, ensuring cutting stability. | ||
| 3. The worktable can be manually or programmably rotated through a full 360°. | ||
| 4. A pneumatic tensioning system is employed, utilizing imported pneumatic components to ensure more stable and reliable tensioning force. | ||
| 5. The PLC control system and large-size touch screen ensure simple and quick operation. | ||
| 6. We can design a variety of auxiliary tooling and fixtures tailored to your needs. | ||
| Functional Uses | Ceramic materials | Alumina ceramics, zinc oxide ceramics, zirconia ceramics, target ceramics, honeycomb ceramics, semiconductor ceramics, conductive ceramics, and non-conductive ceramics, among others; |
| Crystalline materials | Graphite, silicon crystals (solar-grade polycrystalline silicon and monocrystalline silicon), sapphire, alumina crystals, infrared glass crystals, alumina crystals, silicon carbide crystals, cesium iodide crystals, and others. | |
| Glass materials | Chalcogenide glass, optical glass, quartz glass, infrared glass, glass tubing, and more | |
| Metallic materials | Metals and alloys such as iron, aluminum, copper, titanium alloys, and magnesium alloys, as well as nonferrous metals (zinc sulfide, ferrite), etc. | |
| Composite material | PVC boards, carbon fiber composites, glass fiber composites, and others | |
| Rock material | Precision cutting of natural rocks, jade, meteorites, jadeite, agate, and other high-value materials; precision slicing of various high-value materials; as well as block-cutting and thin-section preparation for geological samples, including sedimentary rocks, igneous rocks, metamorphic rocks, and ores. | |
| Thermoelectric materials | Bismuth telluride, lead telluride, silicon-germanium alloys, and others | |
| Infrared optical materials | Zinc selenide, zinc sulfide, silicon, germanium, and other crystals | |
| Biomedical Materials | Bioplasticized specimen sections (including human and animal organs, combined soft–hard tissue sections of the jawbone, implant observation sections, crown–bridge tooth sections, and other histological specimens of teeth); orthopedic soft–hard tissue combined sections (covering fresh and hard tissues such as the femur, hip joint, and vertebral bodies, as well as bone histology samples with implants); cardiovascular and cerebrovascular stent sections; calculus sections; and other medical tissue sections. | |
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