Four-Target Magnetron Sputtering Coating System with a Transition Chamber

This product is a high-cost-performance magnetron sputtering coating system independently developed by our company, featuring standardization, modularity, and customizable options. The magnetron targets are available in 1-inch, 2-inch, 3-inch, and 4-inch sizes, allowing customers to select the appropriate size based on the dimensions of the substrates to be coated. The system is equipped with a 500 W DC power supply and a 500 W RF power supply: the DC power supply is suitable for depositing metallic films, while the RF power supply is ideal for non-metallic films; four targets can meet the requirements of multi-layer or repeated coating processes. For additional coating needs, custom RF power supplies and pulsed power supplies can be configured, with a wide range of power ratings from 300 W to 1,000 W available for each type.

The equipment comprises a main chamber and a transfer chamber, with the latter equipped with a magnetic push rod; a vacuum gate valve is installed between the two chambers. While sputtering is underway in the main chamber, samples can be loaded into the transfer chamber and subjected to preliminary vacuum pumping. Once sputtering in the main chamber is complete, the samples can be transferred into the main chamber’s sample holder via the magnetic push rod. This design reduces the number of times the main chamber needs to be evacuated, thereby not only saving time but also maintaining a superior local vacuum, which effectively enhances coating quality.
This product can be used to prepare single-layer or multilayer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard coatings, polytetrafluoroethylene films, and more. Compared with similar equipment, this four-target magnetron sputtering coating system is not only widely applicable but also features a compact footprint and ease of operation, making it an ideal instrument for laboratory-scale thin-film fabrication. The high-vacuum environment in which the entire evaporation process takes place ensures that evaporated atoms or molecules reach the substrate directly, thereby avoiding contamination by atmospheric impurities and enhancing film quality. Moreover, the high-vacuum conditions help minimize oxidation of the evaporation materials, further improving film purity and performance.