Dual-Target Plasma Sputtering Coater (Basic Model)

Category: Thin Film Preparation

This product employs a two-stage sputtering process and is widely used for SEM sample preparation and metal thin-film deposition experiments. Utilizing low-temperature plasma sputtering, the deposition process operates without high temperatures, thereby minimizing thermal damage. The compact plasma sputter system features a PLC control system with full touchscreen operation, making it easy to learn and use. This model is also equipped with a rotating sample stage, which effectively enhances coating uniformity. (This equipment is fitted with a rotary heated sample stage, further improving coating uniformity and film adhesion.) The compact plasma sputter system utilizes a PLC control system with full touchscreen operation, ensuring ease of use. With its compact footprint and elegant design, it is the ideal choice for laboratory thin-film deposition experiments.

Overview

Technical Specifications

This product is positioned around the core principles of “dual-target synergy, plasma enhancement, dense and uniform film deposition, and precise, easy-to-control operation,” balancing research-grade precision with operational convenience. It is perfectly suited to the diverse thin-film deposition scenarios encountered in university, research institute, and corporate laboratories, providing stable and reliable hardware support for high-quality sputter deposition of materials such as metals, oxides, and semiconductors.
Key features:
1. Dual-Target Independent Sputtering: Equipped with two independent target stations, this system supports simultaneous or alternating sputtering of multiple material targets, enabling the deposition of single-layer and multilayer composite films without frequent target changes, thereby significantly enhancing experimental efficiency.
2. Plasma-Enhanced Process: This process employs plasma-enhanced sputtering to increase the ionization rate of the target material and the kinetic energy of the sputtered particles, resulting in stronger film adhesion, higher density, and a significant reduction in defect rates, thereby enabling the fabrication of high-performance functional thin films.
3. High-Vacuum Clean Coating: The high-vacuum chamber design effectively isolates the coating process from external impurities and minimizes gas interference, ensuring film purity, preventing oxidation-related defects, and meeting the requirements of high-precision coating processes.
4. Convenient and Easy-to-Use Operation: Touchscreen interface combined with preset sputtering process curves, supporting the storage and recall of multiple parameter sets to streamline operation, lower the learning curve, and minimize human error.
5. Wide range of applications: It can be used to deposit thin films on various substrates, including silicon wafers, crystals, glass, and ceramics, and is extensively employed in thin-film fabrication experiments across fields such as materials science, optoelectronic devices, semiconductor research and development, and new energy.

Project Details
Sample Platform Size 100mm
Distance to the target surface Height adjustable from 20 to 35 mm
Plasma sputtering target Quantity 2 inches x 2
Cooling method Natural cooling
Vacuum chamber Cavity dimensions φ180mm × 200mm
Observation Window Omnidirectional Visibility
Cavity material High-purity quartz
Activation method Top-cover detachable
Material of the top and bottom covers 304 stainless steel
Vacuum port KF25
Intake port 1/4-inch ferrule fitting
Power Configuration Quantity DC power supply x1
Output power *Large 150W
Sputtering power supply 3000V
*Large sputtering current 50mA
Vacuum system Vacuum Pump Type Two-stage rotary vane vacuum pump
Vacuum port KF25
Exhaust port KF16
Pumping speed 1.1 L/s (4 m³/h)
Ultimate vacuum degree ≥1Pa
Vacuum measurement Resistance vacuum gauge
Other Power supply AC 220V 50Hz
Total machine power 1.5kW
Overall dimensions 570mm x 450mm x 500mm
Overall weight 30kg

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