Three-Target Plasma Sputtering Coater
Category: Thin Film Preparation
Overview
Technical Specifications
This product is a high-performance system specifically developed to meet the demanding requirements of laboratory-scale, high-end multi-component, multilayer thin-film fabrication. Centered on the core principles of “multi-target synergy, precise film deposition, and comprehensive functionality,” it strikes an optimal balance between research-grade precision and practical usability. It is ideally suited for a wide range of applications in university, research institute, and corporate laboratories, including cutting-edge scientific research and small-batch production, providing stable and reliable hardware support for the preparation of diverse composite thin films composed of metals, alloys, and compounds.
Key features:
- Three-Target Collaborative Design: Equipped with three independent plasma sputtering target stations, this system supports single-target independent sputtering, dual-target co-sputtering, and alternating or simultaneous three-target sputtering, enabling flexible and precise deposition of multilayer films, alloy films, and composite functional films, thereby significantly expanding the range and diversity of experimental processes.
- Precision Film-Deposition Assurance: Equipped with a stable plasma excitation power supply and a high-precision vacuum control system, this system delivers uniform plasma density and a stable, fluctuation-free sputtering process, resulting in dense, uniform films with strong adhesion. It enables precise control over film thickness and performance consistency, meeting the stringent requirements of advanced scientific research experiments.
- Convenient and easy-to-control operation: intelligent touch-screen interface combined with multiple sets of storable process curves, supporting precise parameter adjustment to simplify complex coating procedures, lower the learning curve, enable quick onboarding for beginners, reduce human error, and enhance experimental efficiency.
- Laboratory adaptation and optimization: modular, compact design with moderate dimensions, robust durability, efficient space utilization, easy maintenance, low operating noise, and compatibility with various laboratory benchtop configurations, seamlessly meeting the needs of both research experiments and teaching demonstrations.
- Wide range of application scenarios: It can be used to fabricate various functional thin films, including metals, alloys, oxides, nitrides, and more, with extensive applications in high-end research fields such as semiconductor device R&D, optical coating fabrication, sensor development, new energy materials research, and material surface modification.
| Project | Details | |
| Sample Platform | Size | 100mm |
| Distance to the target surface | Height adjustable from 20 to 35 mm | |
| Rotational speed | Adjustable from 1 to 20 rpm | |
| Plasma sputtering target | Quantity | 2 inches x 2 |
| Cooling method | Natural cooling | |
| Vacuum chamber | Cavity dimensions | φ180mm × 200mm |
| Observation Window | Omnidirectional Visibility | |
| Cavity material | High-purity quartz | |
| Activation method | Top-cover detachable | |
| Material of the top and bottom covers | 304 stainless steel | |
| Vacuum port | KF25 | |
| Intake port | 1/4-inch ferrule fitting | |
| Power Configuration | Quantity | DC power supply x1 |
| Output power | *Large 150W | |
| Sputtering power supply | 3000V | |
| Sputtering current can reach | 50mA | |
| Vacuum system | Vacuum Pump Type | Two-stage rotary vane vacuum pump |
| Vacuum port | KF25 | |
| Exhaust port | KF16 | |
| Pumping speed | 1.1 L/s (4 m³/h) | |
| Ultimate vacuum degree | ≥1Pa | |
| Vacuum measurement | Resistance vacuum gauge | |
| Other | Power supply | AC 220V 50Hz |
| Total machine power | 1.5kW | |
| Overall dimensions | 570mm x 450mm x 500mm | |
| Overall weight | 30kg | |
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